Company:

Qualcomm Korea YH

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

General Summary:

Role Overview

We are looking for a highly motivated Packaging Engineer capable of leading state-of-the-art advanced IC packaging development and new product introduction of leading-edge package technologies for AI, Mobile, Bluetooth, WiFi, IoT, Power Management, Connectivity, Automotive, and new emerging markets, and driving that innovation into high-volume manufacturing at assembly suppliers.

Extensive knowledge and experience in Flip Chip, Wire Bond, and System-in-Package assembly processes, materials, and equipment are required. This role also requires the ability to lead multi-functional teams and solve complex technical problems while working with multiple OSATs. Experience working on projects involving Wafer-on-Wafer bonding is a plus.

Responsibilities

• Responsible for exploring, developing, and deploying FCCSP, FCBGA, and/or SiP/Module packaging technologies into HVM.
• Responsible for initiating and defining package process flows, material sets/BKM, test vehicles, DOEs and cornering, and process control plans to successfully develop manufacturable and reliable products.
• Interface with OSATs, substrate/material suppliers, and tool makers to develop technologies aligned with product requirements.
• Align with internal product teams on design rules and their establishment.
• Collaborate with internal design teams to drive DFM methodologies for new technologies.
• Work with internal design, modeling, and procurement teams to implement technically optimal and cost-effective packaging solutions.
• Provide technical program management to plan, execute, and monitor complex process or product development activities.
• Provide regular program status updates to management and cross-functional teams.
• Demonstrate strong knowledge and understanding of FMEA, SPC/QC concepts, failure mechanisms, failure analysis techniques, manufacturing floor operations, and quality issue handling.
  
  
  

Minimum Qualifications

• Minimum of 10 years of experience in advanced IC package development and high-volume manufacturing.
• Expertise in Flip Chip CSP, FCBGA, and SiP packaging materials, assembly processes, equipment, and design rules.
• Strong understanding of Laser Groove technology and Wire Bond process optimization.
• Excellent verbal and written communication skills.
• Demonstrated organized technical project management skills.
• Ability to work independently and lead multiple programs.
• Ability to lead multi-functional teams to solve complex technical problems.
• Self-driven, passionate, and creative.
  
  
  

Preferred Qualifications

• Hands-on experience in package manufacturing, technical project management, and direct engagement with semiconductor material suppliers.
• Understanding of industry packaging trends, end-user packaging considerations, and experience with high-end mobile consumer products.
• Proficiency in material and package characterization and statistical data analysis.
• Knowledge of reliability test methods and qualification procedures.
• Six Sigma Green Belt or Black Belt certification is a plus.
  
  
  

Educational Requirements

• Required: Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, a related discipline, or equivalent practical experience.
• Preferred: Master’s degree or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, or a related engineering field.
  
  
  

Minimum Qualifications:

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience.
  
  
  

OR

Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience.

OR

PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience.

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