Company

Qualcomm Technologies, Inc.

Job Area

Engineering Group, Engineering Group > Software Engineering

General Summary

• This position is not eligible for Qualcomm immigration sponsorship. **
  
  
  

The Snapdragon chipsets have pushed the power envelope of Compute products with more and more complex use cases and workloads. This has introduced significant challenges in extending the battery life of the product on one spectrum and achieving superior performance within the device thermal and power envelope on the other spectrum. Coming up with diverse and innovative approaches in software is very critical in solving these broad and deep cutting-edge technical problems. Interested in playing a key role in optimizing thermal performance of next generation compute products running Windows on Snapdragon? Join Qualcomm’s Thermal and Limits Management Systems Software team to work on bleeding edge Windows on Snapdragon products. Join QUALCOMM’s team in San Diego, CA, and work closely with System engineers, Software and Hardware developers in a world-class team. Enjoy life in sunny San Diego on the Pacific coast of California.

Role

In this role, the candidate is expected to own and drive the analysis of complex system level use cases spanning across various System on Chip technologies and coming up with solutions to improve performance of the compute products under the power and thermal constraints. The scope of work spans across a variety of workloads touching every aspect of the silicon including CPU/GPU/AI benchmarks, Productivity use cases, Streaming scenarios, Gaming use cases, Media streaming and High-throughput Modem use cases. An ideal candidate would have prior experience working on Windows products and/or experience with power/thermal/performance analysis at the product level. In addition, the candidate is also expected to contribute to:

• Development of algorithms and techniques to optimize power consumption and thermal performance of various compute use cases.
• Perform system level software optimizations using hardware and software power/thermal management techniques
• Use advanced machine learning techniques in solving system level power and thermal problems
  
  
  

Minimum Qualifications

• Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.
  
  
  

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

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Pay Range And Other Compensation & Benefits

$94,200.00 - $141,200.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.

If you would like more information about this role, please contact Qualcomm Careers.