Company

RF360 Singapore Pte., Ltd.

Job Area

Engineering Group, Engineering Group > Hardware Engineering

General Summary

Job Scope

• Responsible for development, qualification, and high-volume production transfer of new processes, materials, and manufacturing technologies.
• Ensure process readiness, robust manufacturability, and smooth ramp‑up through strong cross‑functional coordination, data‑driven decision‑making, and process leadership.
• Initiate and participate actively in discussions on formulation of process technology innovation and release process improvement.
• Collaborate and develop effective working relationships with technology partners to accomplish project/ task goals within committed schedule.
• Develop new and impactful ideas, materials, solutions, and/ or procedures for product fabrication process and technology meeting the business goals and launch schedule with competitive manufacturing costs.
• Serve as technology subject matter expert applying technical knowledge and skills in own area of expertise to address moderately complex issues in manufacturing environment.
  
  
  

Job Responsibilities

Technology Development

• Lead and/ or co-work with global process cluster on new process recipes from concept to qualification and manufacturing release.
• Define process requirements, success criteria, design‑of‑experiments (DOE), and characterization plans.
• Drive root‑cause analyses, failure mechanism studies, and improvement loops to achieve performance, yield, and reliability targets.
• Translate product requirements into process specifications and control strategies. Technology Transfer & Ramp
• Work with project leader on technology transfer - from pilot line to high‑volume manufacturing. Adapts to shifting priorities while ensuring deadlines are met.
• Lead and drive technical discussions to onsite process transfer activities, including documentation (PFMEA, etc), training, process replication, and equipment matching.
• Work with equipment team on equipment set up and process cluster on establishing critical process windows, statistical control limits, and ramp‑readiness criteria.
• Coordinate and report ramp performance tracking (yield, scrap, cycle time, tool capability) and drive closure of gaps.
  
  
  

Education/ Experience Requirements

Bachelor’s or Master’s degree in Engineering (Material Science, Mechanical Engineering, Chemical Engineering, or related fields).

• 3+ years of experience in Chemical Mechanical Planarization (Polishing) process engineering, process development, or as process engineer in a high-volume manufacturing fab.
• Strong skills in DOE, SPC, data analytics, FMEA, and troubleshooting.
• Excellent communication, technical documentation, and stakeholder management skills.
  
  
  

Skills, Abilities & Knowledge

• Resourceful with critical thinking in problem solving.
• Project and priority management skills.
• Experience in semiconductor, MEMS, packaging, or high‑volume manufacturing.
• Familiarity with yield engineering, reliability mechanisms, and failure analysis as well as use of statistical tools, DOE, PFCP/ PFMEA, etc.
• Experience with scale-up from R&D → Pilot → HVM.
• Knowledge of Lean, Six Sigma, or structured problem-solving (8D, DMAIC).
• Able to multi-task, set priorities and meet critical deadlines. Maintain open communication.
• Able attend training program overseas at sister’s fab for up to 1 year.
  
  
  

Minimum Qualifications

• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.
  
  
  

OR

Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience.

OR

PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.

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