Company

RF360 Singapore Pte., Ltd.

Job Area

Engineering Group, Engineering Group > Hardware Engineering

General Summary

Job Scope

• Lead wafer probing and failure analysis team in achieving product yield, output and cost effectiveness.
• Maintain effective, accurate and robust measurement procedures in wafer probing.
• Ensure smooth process flow with high quality, high yield, low cost by working with cross functional teams to achieve the overall committed targets.
• Support new technology and qualification setup.
  
  
  

Job Responsibilities

• Perform comprehensive wafer probing and failure analysis and report failure analyses timely.
• Work with process technician and yield engineers on effective hold lots dispositions.
• Ensure wafer prober measurement integrity and prober matching across all wafer probers.
• Analyze and reduce NTF to improve wafer prober measurement integrity.
• Design and set up proper probe cards/cores maintenance and management.
• Contribute in quality investigations and continuous improvement programs to resolve chronic process and quality issues, and institute permanent resolutions to assure product quality and enhance process robustness.
• Proactively drive team deployment and apply hands-on and with deep involvement at work.
• Regular reviews of OCAP, FMEA and Control Plans.
• Ensure timely update of procedures and effective implementations.
• Coach and guide process technicians in process, failure and yield analyses and product to build up their technical competencies
• Take accountability of work and possesses strong sense of responsibility
  
  
  

Education/Experience Requirements

• At least a Bachelor’s degree in Electronic or Electrical Engineering or Material Science or equivalent.
• Fresh graduates who like hands on activities or Engineers with 1-2 years of working experience.
• Direct working experience in wafer fab process integration will be added advantage.
• Possess strong technical competencies in his field of study.
• Able to work under pressure and with strong commitment at work.
• Good knowledge of statistical and quality tools.
• Experience with software applications such as MS Power Point, Excel and Word.
  
  
  

Skills, Abilities & Knowledge

• Good knowledge of wafer fab manufacturing processes and capable of applying them effectively at work.
• Good yield and product analyses skills.
• Strong organizational, leadership, communications, and interpersonal skills.
• Systematic troubleshooting and problem solving skills using DMAIC, cause-and- effect, 5 Whys analysis, etc.
• Application of quality and SPC tools at work - FMEA, DOE, SPC, etc.
• Dynamic, resourceful, creative, innovative and self-driven.
• Able to multi-task, set priorities and meet deadlines
  
  
  

Minimum Qualifications

• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.
  
  
  

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